14th International Symposium on Sound Engineering and Tonmeistering
The 14th International Symposium on Sound Engineering and Tonmeistering will
be held on May 19-21, 2011, in Wrocław. The Symposium is organized by the Chair
of Acoustics, Institute of Telecommunications, Teleinformatics and Acoustics, Wrocław
University of Technology, under auspicious of the Polish Section of the Audio Engineering
Society. The organizers cordially invite sound engineers, music producers, acousticians,
and specialists in sound reinforcement, scientists who deal with sound engineering,
sound recording and related areas, students, and employees of the audio industry to participate
in the Symposium. The Symposium programme will include lecture sessions and
workshop presentations.
http://acoustics.ippt.gov.pl/index.php/aa/article/viewFile/191/180
Blandt deltagerne
http://pe.org.pl/articles/2011/9a/61.pdf
Legger ved denne også siden den omtaler litt av det samme
https://tspace.library.utoronto.ca/bitstream/1807/11348/1/MQ28872.pdf
. 1 . 4 Applications for the O C C products
For instance, extremely fine wires and thin plates with a diameter and thickness
of 10 microns or 20 microns and no intemal defects have become necessary, such as
lead frames and bonding wires for use in ICs and LSls [
3, 5, 6 1.
Recently, in order to keep Pace with the progress made in such advanced
technology, there have been sophisticated demands for materials having no crystal
grain boundaries, which in the past was inconceivable, such as copper wire for use in
acoustic applications [12
Mye arbeid som er lagt ned i forskning,men allikevel til ingen nytte i audiobransjen,vistnok.
The 14th International Symposium on Sound Engineering and Tonmeistering will
be held on May 19-21, 2011, in Wrocław. The Symposium is organized by the Chair
of Acoustics, Institute of Telecommunications, Teleinformatics and Acoustics, Wrocław
University of Technology, under auspicious of the Polish Section of the Audio Engineering
Society. The organizers cordially invite sound engineers, music producers, acousticians,
and specialists in sound reinforcement, scientists who deal with sound engineering,
sound recording and related areas, students, and employees of the audio industry to participate
in the Symposium. The Symposium programme will include lecture sessions and
workshop presentations.
http://acoustics.ippt.gov.pl/index.php/aa/article/viewFile/191/180
Blandt deltagerne
http://pe.org.pl/articles/2011/9a/61.pdf
Legger ved denne også siden den omtaler litt av det samme
https://tspace.library.utoronto.ca/bitstream/1807/11348/1/MQ28872.pdf
. 1 . 4 Applications for the O C C products
For instance, extremely fine wires and thin plates with a diameter and thickness
of 10 microns or 20 microns and no intemal defects have become necessary, such as
lead frames and bonding wires for use in ICs and LSls [
3, 5, 6 1.
Recently, in order to keep Pace with the progress made in such advanced
technology, there have been sophisticated demands for materials having no crystal
grain boundaries, which in the past was inconceivable, such as copper wire for use in
acoustic applications [12
Mye arbeid som er lagt ned i forskning,men allikevel til ingen nytte i audiobransjen,vistnok.